Chaun Choung Technology Corp. ( CCI ) was founded in 1973. The company is specialized in Aluminum and Copper products manufacturing, especially in heat sinks, heat pipes, thermal modules, front panels and covers. Over 30 years of experience, CCI is now the leader in heat sink manufacturing in the world.
The company has an excellent reputation in quality control and production capacity. This reputation is achieved by combining a strong R&D team, the total quality control concept, and an integrated operation procedure.
Although the company is running smoothly and the business is growing steadily. CCI realizes the company will lose the competitiveness if it is just holding the current position but no improvement. In order to go a step future, to meet new challenges, and to offer better service to its customers, CCI is aggressively establishing new factories, incorporating new equipment, and improving the quality of current products.
In 1995, CCI teamed up with Industrial Technology Research Institute ( ITRI ) for the micro heat pipe research. With the success of the project, CCI became the first company in Taiwan producing micro heat pipes. The combination of traditional heat sink and hi-tech heat pipe makes CCI more advanced in the field of heat sink and thermal module manufacturing.
From 1997, CCI begun the mass production for thermal module in NB industry; CCI is the top 3 suppliers of thermal module in NB over the world until now.
In 2002, CCI teamed up with Industrial Technology Research Institute ( ITRI ) again for vapor chamber research. In order to enhance the heat pipe technology and solve the heat problem, CCI cooperated with ITRI to develop the vapor chamber.
In 2004, CCI got ISO 14001 and OHSAS 18001 certification. Also CCI goes into the desktop thermal industry aggressively, combined the heat pipe and stacked fin heat sink to apply to desktop CPU cooler. It earned much applause for CCI because it is based on the plenty experiences in NB field.
CCI does design and offer highly customized to specific applications with high quality broad technology offerings i.e. extrusion, stacked/punching fix fin, heat pipe and liquid cooling modules... etc. which an aggressive technology extending out about 12 years. We are on the way to achieve the goal "being a key player in the international market of heat transfer devices". We believe that with our comprehensive service and endless effort, the goal will become reality.