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silecs
聯絡人:鍾先生
電話:
地址:北歐芬蘭Kutojantie 2 B, 02630 Espoo, Finland
網址:http://www.silecs.com/




公司簡介
Silecs於2000年成立於芬蘭,致力於半導體與封裝相關Spin-On化學材料研發製造與銷售,目前客戶涵蓋全球各大半導體公司。

Silecs is an innovator of enabling materials used in the microelectronics industry, particularly for semiconductor and flat panel display manufacturing. We serve a global market for electronic chemicals and materials that is expected to reach $34.8 billion by 20101.

Our broad range of unique electronic materials, developed through molecular engineering, meets customers' stringent performance and integration requirements, while helping to reduce their production costs. Silecs' expertise in product development, application engineering and state-of-the-art production techniques translates to faster time to market for customers, delivering the performance required for even the most advanced device designs.

Founded in 2000, Silecs is a privately held company backed by leading European institutions. Silecs Oy is located in Espoo, Finland, and serves as the company's innovation center, with research, development and a world-class ISO 9001 and ISO 14001 -certified manufacturing operation. Silecs also provides local and regional customer support through an extensive global network. Silecs Oy’s subsidiaries are located in Singapore and Hong Kong.

Silecs Vision
To ensure the success of our customers and their products through consistently innovative materials and superior service; deliver excellent returns to our investors.


1Source: BCC Research, 'Electronic Chemicals and Materials: The Global Market' 9/1/06
營業性質
營業性質:
製造商
產業類別:
塗料、膠黏劑、二極體
主要商品服務:
SOG,SOD,SOC所有Spin-On相關之化學塗佈材料

Microelectronic devices are fabricated in intricate, multi-step processes in which chemical materials are deposited in ultra-thin layers on a substrate—usually a silicon wafer. Silecs materials are supplied in liquid form, and thus, the technique for applying them is with sophisticated spin-coater systems that carefully deposit measured amounts of material onto a substrate. The system then spins the substrate rapidly to spread the material across the surface, hardened into a highly-uniform thin film. This film then becomes a permanent part of the microchip that directly influences its performance, based on the chemical composition of the film.

Our products become part of everyday electronic products through standard semiconductor production processes.
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