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艾克爾國際科技股份有限公司(Amkor Technology Taiwan)
聯絡人:莊先生
電話:
傳真:
地址:桃園市龍潭區中豐路高平段1號
網址:http://www.amkor.com




公司簡介
艾克爾國際科技(Amkor Technology)為美商跨國IC封裝測試大廠,美國那斯達克股票公開上市之公司(Nasdaq: AMKR),在美國、日本、韓國、菲律賓、新加坡、上海、台灣都有生產據點,全球員工總數約25000人左右。台彎地區現有龍潭廠(T1)、湖口廠(T3)及艾克爾先進科技(T5,為原悠立半導體),台灣地區員工總數約3000人,為客戶提供多元化服務。除了服務國內IC廠之外,美國、日本等世界各地的IC大廠也是本公司服務的重要對象。

主要封裝產品為錫鉛凸塊, Flip Chip, Lead Frame及全球獨家的DLP等,是符合市場潮流的科技產業。為因應未來市場需求及公司持續成長,竭誠歡迎各界菁英加入我們的團隊。

Amkor Technology is the worlds largest independent supplier of outsourced packaging and test semiconductor interconnect services. With more than 40 years of continuous improvement, growth and innovation, Amkor has become a trusted partner for most of the worlds leading semiconductor suppliers, providing the packages service and technology necessary for continued progress.

【龍潭廠】(T1廠)
地址:桃園縣325龍潭鄉中豐路高平段一號
電話:(03)4116000 #11222
【湖口廠】(T3廠)
地址:新竹縣湖口鄉湖口工業區光復路11號
電話:(03)598-2000 #31221
【先進廠(悠立廠)】(T5廠)
地址:新竹縣湖口鄉湖口工業區光復北路39號
電話:(03)597-2777 #52110


【E-mail】att1recruit@amkor.com

【公司網址】
http://www.amkor.com


經營理念
※ PURPOSE
Use our collective talents and energies to achieve prosperity and fulfillment for our customers, our company, and our people.
※ MISSION
Be the world’s premier Semiconductor Wafer, Assembly and Test Service Company through customer satisfaction, leading edge technology, and financial performance.
※ VALUES
1.Respect & Integrity
2.Caring & Well Being of Our People
3.Teamwork & Cooperation
4.High Energy
5.Open Communication
※ COMMITMENT
1.To relate these values to our individual work ethics.
2.To hold each other accountable for these values.
3.To have no retaliation for holding each other accountable.
4.To build a stronger team as a result of this process.
5.To excel in the market place through acting in alignment with these values.
6.To make the purpose, mission and values a reality.
營業性質
營業性質:
製造商
產業類別:
電子產品
主要商品服務:
※ QFP/ BGA/ P-DIP/ Flip Chip / Vision PAK/ DLP/ CABGA

【優良事蹟】:
*87/6通過ISO 9000認證
*89/10通過QS 9000認證

【專 利】:
☆《美國、日本》/ 懸吊式晶片構裝結構專利
☆《中華民國、美國》/ 積體電路構裝體導線架之改良結構專利
☆《中華民國》/ 積體電路構裝體內部脫層之防制設計專利
☆《美國》/ 內建式晶片散熱結構專利
☆《中華民國》/ 晶圓封裝專利

Our company mainly deals with IC packaging development, design, assembly, production, testing as well as sales, and IC parts R&D, design, testing as well as sales. Besides domestic customers, we also serve overseas customers, such as US/Japan-companies.

【PACKAGE TYPE】:
※ QFP/ BGA/ P-DIP/ Flip Chip / Vision PAK / DLP/ CABGA


【CERTIFICATED】:
*JUN,1998/ ISO9000 certificated
*OCT,2000/ QS9000 certificated

【PATENT】:
☆《USA/JAPAN PATENT》/ Semiconductor Packaging Structure with Tie Bar on Chip
☆《R.O.C/USA PATENT》/ Universal Leadframe for Semiconductor Devices
☆《R.O.C PATENT》/ IC Package Delamination Prevention Design
☆《USA PATENT》/ Integral Heat Spreader for Semiconductor Package
☆《R.O.C PATENT》/ Wafer Level Package
無其他商品資料!